NanoMaker software is based on R&D activity performed mainly in Institute
of Microelectronics Technology RAS since 1989.
During this time improvements of e-beam technology processes and setup operating
were developed and implemented in the software in close contact with experimentalists
and technologists (see selected reference list below).
I. Contributions to electron beam technology
proximity correction, guaranteed accuracy of the correction [1,
2, 8,
11]
Main advantage of the "simple compensation" method developed for
proximity correction in comparison to other correction procedures is its guaranteed
accuracy.
models and simulation methods for development of positive [4, 5]
and negative resists [6]
Simulation of development after exposure allows one to predict result of lithography
with high confidence
3D lithography (3D proximity correction and development) [8, 9, 11,
25]
Special methods and procedures were suggested to fabricate desirable relieves
(shape of resist surface) [8] with main applications in diffractive optics
(calculated holograms, photonic structure) and cell biology [27].
direct measurements of proximity parameters [7, 10, 17] (data base
of proximity parameters)
Quality and accuracy of lithography depends on proper value of proximity parameters
[17]. NanoMaker contains a database for the parameters as function of substrate
material and accelerating voltage. The data base were accumulated for several
years as result of special experiments. Difficulty of experimental measurement
is defined by large difference in scale of the parameters (for example beam diameter
(Alpha) belongs to range ten(s) nanometer where as proximity distance (Beta) is
hundreds times larger). Special experimental method (fitting before measurement)
was developed for definition of the proximity parameters [7, 10].
II. Software improvements of lithographic machine operation
Much attention and efforts were devoted to elimination of sources and reasons
of accuracy losses of e-beam lithographs.
distortion correction [14]
One of such reasons is distortion (static nonlinear errors in beam position
far from the center of a scanfield). NanoMaker contains special procedures
for distortion compensation during writing. NanoMaker allows one to measure
(to characterize) distortion of a particular SEM (or a lithograph) with a
special procedure as well.
delays compensation [14]
Another source of accuracy loss is delay of beam position on exposed substrate
in comparison to desirable (addressed) value. A special procedure for measurement
of delay parameters of a lithograph is implemented in NanoMaker so NanoMaker
is able to compensate delay errors on "fly" what results to significant
reducing total exposure time and simplifying exposure (blank system now is
not necessary).
control of non-SEM lithographs [12, 13] and hysteresis compensation
in Scanning Probe (AFM) machines [23].
NanoMaker can control scanning devices of different types for example setup
of focused ion beam [12, 13] and scanning probe microscope. A new type of
errors is found in the latter device, NanoMaker contains a mode for compensation
of hysteresis (long-term temporary distortion) and procedures for hysteresis
parameters definition [23].
III. Applications of NanoMaker
diffractive optics
Ability to fabricate predisigned relieves based on 3D proximity correction
are using for fabrication of diffractive optics of high efficiency like Fresnell
zone plates, kinoform optics and calculated holograms [14, 15].
X-ray diffractive optics
Proximity correction implemented in NanoMaker turned to be very important
for fabrication of high quality X-ray diffractive optics [21, 22]
heating effects
Usage of high throughput e-beam machines with variable beam shape and ultimate
current density can result to temperature increasing at exposure area. Method
for consideration of e-beam heating contribution in exposure dose is developed
[18, 19]. Heating during exposure results to overexposure therefore an approach
for heating effect compensation is suggested [20].
Micro/Nano devices
Some selected examples of microdevices fabrication and testing could be found
in [13, 24, 25, 26].